Wykaz publikacji wybranego autora

Tadeusz Knych, prof. dr hab. inż.

profesor zwyczajny

Wydział Metali Nieżelaznych
WMN-kpp, Katedra Przeróbki Plastycznej i Metaloznawstwa Metali Nieżelaznych

  • 2018

    [dyscyplina 1] dziedzina nauk inżynieryjno-technicznych / inżynieria materiałowa

[poprzednia klasyfikacja] obszar nauk technicznych / dziedzina nauk technicznych / metalurgia

Identyfikatory Autora Informacje o Autorze w systemach zewnętrznych

ORCID: 0000-0002-9542-1603 orcid iD

ResearcherID: M-5431-2019

Scopus: 6602567364

PBN: 5e709213878c28a04738f894

OPI Nauka Polska

System Informacyjny AGH (SkOs)

1
  • A new generation of aluminium enamelled winding wires
2
  • A study of a new generation of multi-functional aluminium alloys for the power industry
3
  • A study of the artificial ageing on the the low temperature creep of AlMgSi (AA6201) wires
4
  • A study of the influence of strain hardening and precipitation hardening sequence on development of mechanical properties of AlMgSi conductor alloys
5
  • A study of the influence of strain hardening and precipitation hardening sequence on mechanical properties of AlMgSi conductor alloys
6
  • An analytical model for the high temperature low sag conductor knee point determination
7
  • Analysis of causes of aluminium and copper wire breakages during the drawing process
8
  • Analysis of shape, size and quantity of the Cu2O oxides in the deformation process during the drawing of Cu-ETP wires
9
  • Analysis of the antimicrobial copper alloys registered by the environmental protection agency
10
  • Analysis of the technology for manufacturing heat-treatable AlMgSi alloy wire rod, in terms of physical phenomena that affect the structure and properties
11
  • Antibiotic resistance, ability to form biofilm and susceptibility to copper alloys of selected staphylococcal strains isolated from touch surfaces in Polish hospital wards
12
  • Antimicrobial copper-based alloys touch surfaces – current achievements and challenges
13
  • Antimicrobial properties of selected copper alloys on \emph{Staphylococcus aureus} and \emph{Escherichia coli} in different simulations of environmental conditions: with vs. without organic contamination
14
  • Automated stand for testing the mechanical characteristics of overhead power conductors
15
  • Characterisation of Cu-CNTs composite electrical properties in elevated temperatures
16
17
  • Copper alloys for antimicrobial touch surfaces – research on practical and scientific aspects
18
  • Copper-chromium alloy, method of manufacturing thereof, the use of this alloy for making cap electrodes and a method of manufacturing a cap electrode using this alloy
19
  • Creep in modern materials
20
  • Defects analysis of copper wires manufactured in industrial conditions
21
  • Dynamic recrystallization of continuous cast copper wire rod and the rapid tensile test
22
  • Dynamic recrystallization of continuous cast copper wire rod and the rapid tensile test
23
  • Effect of Cu content on the antimicrobial properties of copper alloys
24
  • Effect of grain refiner additions on mechanical and electrical properties of aluminium and its behaviour during cold rolling
25
  • Effect of iron addition to aluminium on the structure and properties of wires used for electrical purposes